Display & Semiconductor Solutions

Laser Technology for the Semiconductor Manufacturing Industry

Resolving Challenges in Semiconductor Marking and Wafer Dicing

Laser Photonics is at the forefront of semiconductor manufacturing technology, offering cutting-edge laser solutions that revolutionize production processes. Our advanced laser systems provide unparalleled precision, speed, and efficiency for critical operations such as wafer marking, dicing, and chip serialization. By leveraging state-of-the-art machine vision and through-the-optics vision (TTOV) configuration, we ensure high-speed fiducial recognition and accurate marking, even on the smallest components.

Advancing Display & Semiconductor Manufacturing Technologies

Our laser technology addresses key challenges in semiconductor production, enhancing yield, reducing material waste, and enabling manufacturers to meet the ever-increasing demands of the industry. With Laser Photonics’ innovative solutions, semiconductor manufacturers can achieve superior quality, consistency, and throughput in their operations.

Laser Solutions for the Semiconductor Manufacturing Industry

Laser Wafer Marking System

Advanced laser systems offer accuracy, consistency, and speed in critical battery manufacturing processes such as electrode cutting, tab welding, and case sealing. These high-tech tools enable manufacturers to achieve tight tolerances, reduce material loss and safety issues, and increase throughput. In turn, improved battery performance and range supports the sustainability objectives of green energy suppliers.

Semiconductor Laser Marking System

This system is configured to accept JEDEC trays full of tiny computer chips. The vision system ensures that each marking is positioned squared with the chip so that each mark, regardless of the seated position, is correctly aligned. The system will recognize if the tray isn’t completely full and come to a stop.

Laser Wafer Dicing System

Built for optimal die singulation, the BlackStar is an essential instrument in semiconductor device fabrication. Powered by the patented Fantom Width Laser Dicing (FWLD) technology, this system maximizes die yield per silicon wafer and minimizes material loss.

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