Semiconductor Solutions

Laser Technology for Semiconductor Manufacturing

Breakthrough in Chip Fabrication

Semiconductor manufacturing today must be highly progressive to stay competitive, utilizing the latest technologies available to process silicon and related compounds like silicon carbide and gallium arsenide. Low-heat, high-precision laser technology now powers advanced systems for marking and dicing these valuable materials, increasing throughput, optimizing a chip’s performance, and meeting the demand for ever-smaller sizes.

High-Performance Tools for Superior Chips

Laser Photonics and its subsidiary, Control Micro Systems, develop sophisticated laser equipment for semiconductor manufacturing. Our turnkey and custom-made machines integrate high-performance lasers, machine vision alignment, Through-the-Optics Vision (TTOV), robotic part handling and transport, and other technologies. By partnering with us, chipmakers achieve superior quality, consistency, and throughput in their operations.

Our Solutions for Semiconductor Manufacturing

Wafer Serialization for Traceability

Explore our laser solutions for wafer marking, ranging from compact, handheld Class IV models to enclosed, automated Class I systems with fume extraction. We offer versatile solutions built with fiber, CO₂ or frequency-tripled laser types, depending on the wafer material and our client’s unique needs. This multi-station Wafer Serialization machine is designed for the effective marking of silicon, sapphire, crystal, various compounds, and photoresist. It is configured for wafers of various sizes and integrates a robot for wafer movement.

Semiconductor Laser Marking

We provide custom-designed, automated solutions for fast and precise ultraviolet laser labeling of IC mold compounds and ceramics. Permanently mark data matrices, logos, and other information without any consumables or risk of damage. The Semiconductor Laser Marking system accepts JEDEC trays with small-size chips and employs a high-speed fiducial recognition system for smart alignment.

BlackStar Laser Wafer Dicing

The BlackStar is Laser Photonics’ state-of-the-art laser die singulation system, involving a combination of quick, low-heat laser pulses and separation via mechanical stress. This technology, patented as Fantom Width Laser Dicing, produces a clean, near-zero kerf without micro-cracks, fragmentation, or chipping. It delivers maximum die yield per wafer, even for wafers with thick polymer layers and those less than 100 µm thick.

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